New iPhone 6s schematics have popped up, allegedly leaking the layout of Apple's upcoming A9 system chip, and indicating that the new iPhone will have unusually high number of improvements under the hood, despite keeping the same look and feel as the current iPhone 6.
First off, the leaked chipset drawings indicate that Apple would indeed be employing a System in Package (SiP) technology along with a Printed Circuit Board (PCB) architecture. The SiP technology is used by Cupertino in the Apple Watch, and it allows for faster production of more compact and more efficient ...
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